R: Soldering of Components on Printed-Circuit Boards

solder {rpart} | R Documentation

## Soldering of Components on Printed-Circuit Boards

### Description

The `solder` data frame has 720 rows and 6 columns, representing a balanced subset of a designed experiment varying 5 factors on the soldering of components on printed-circuit boards.

### Usage

    solder

### Format

This data frame contains the following columns:

`Opening`

  a factor with levels `L` `M` `S` indicating the amount of clearance around the mounting pad.

`Solder`

  a factor with levels `Thick` `Thin` giving the thickness of the solder used.

`Mask`

  a factor with levels `A1.5` `A3` `B3` `B6` indicating the type and thickness of mask used.

`PadType`

  a factor with levels `D4` `D6` `D7` `L4` `L6` `L7` `L8` `L9` `W4` `W9` giving the size and geometry of the mounting pad.

`Panel`

  `1:3` indicating the panel on a board being tested.

`skips`

  a numeric vector giving the number of visible solder skips.

### Source

John M. Chambers and Trevor J. Hastie eds. (1992) Statistical Models in S, Wadsworth and Brooks/Cole, Pacific Grove, CA 1992.

### Examples

    fit <- rpart(skips ~ Opening + Solder + Mask + PadType + Panel,
           data=solder, method='anova')
    summary(residuals(fit))
    plot(predict(fit),residuals(fit))

[Package rpart version 3.1-53 Index]